XR2D-2401-N

Omron Electronics Inc-EMC Div

型号:

XR2D-2401-N

封装:

-

批次:

-

数据手册:

描述:

CONN IC DIP SOCKET 24POS GOLD

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr Omron Electronics Inc-EMC Div
Type DIP, 0.6" (15.24mm) Row Spacing
Series XR2
Package Bulk
Features Carrier
Termination Solder
Pitch - Post 0.100" (2.54mm)
Mounting Type Through Hole
Pitch - Mating 0.100" (2.54mm)
Product Status Obsolete
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Contact Resistance 20mOhm
Contact Finish - Post Gold
Current Rating (Amps) 1 A
Operating Temperature -55°C ~ 125°C
Contact Finish - Mating Gold
Contact Material - Post Beryllium Copper
Termination Post Length -
Contact Material - Mating Beryllium Copper
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 29.5µin (0.75µm)
Contact Finish Thickness - Mating 29.5µin (0.75µm)
Number of Positions or Pins (Grid) 24 (2 x 12)