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W66BP6NBUAGJ TR

Winbond Electronics

型号:

W66BP6NBUAGJ TR

封装:

200-WFBGA (10x14.5)

批次:

-

数据手册:

描述:

IC DRAM 2GBIT LVSTL 11 200WFBGA

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr Winbond Electronics
Series -
Package Tape & Reel (TR)
Technology SDRAM - Mobile LPDDR4
Access Time 3.5 ns
Memory Size 2Gbit
Memory Type Volatile
Memory Format DRAM
Mounting Type Surface Mount
Package / Case 200-WFBGA
Product Status Active
Clock Frequency 1.866 GHz
Memory Interface LVSTL_11
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Base Product Number W66BP6
Memory Organization 128M x 16
DigiKey Programmable Not Verified
Operating Temperature -40°C ~ 105°C (TC)
Supplier Device Package 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page 18ns