SBB2802P-1

Chip Quik Inc.

型号:

SBB2802P-1

封装:

-

批次:

-

数据手册:

-

描述:

SOLDER-IN BREADBOARD 1X3" (28 RO

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr Chip Quik Inc.
Pitch 0.1" (2.54mm) Grid
Series Proto-Advantage
Package Bulk
Plating Plated Through Hole (PTH)
Material FR4 Epoxy Glass
Edge Contacts -
Hole Diameter 0.039" (1.00mm)
Product Status Active
Board Thickness 0.063" (1.60mm)
Circuit Pattern Pad Per Hole (Round)
Proto Board Type Breadboard, General Purpose
Size / Dimension 3.00" L x 1.00" W (76.2mm x 25.4mm)