MPF5030BMBA0ES

NXP USA Inc.

型号:

MPF5030BMBA0ES

品牌:

NXP USA Inc.

封装:

40-HVQFN (6x6)

批次:

-

数据手册:

-

描述:

PMIC 3 BUCKS 2 LDO A1 DIE

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr NXP USA Inc.
Series Automotive, AEC-Q100
Package Tray
Applications System Basis Chip
Mounting Type Surface Mount, Wettable Flank
Package / Case 40-PowerVFQFN
Product Status Active
Current - Supply -
Voltage - Supply 3.3V ~ 5.25V
Operating Temperature -40°C ~ 125°C (TA)
Supplier Device Package 40-HVQFN (6x6)