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HSS26-B20-P38

CUI Devices

型号:

HSS26-B20-P38

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-218/TO-2

购买数量:

库存 : 2998

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.7885

  • 10

    0.7638

  • 25

    0.74138

  • 50

    0.6973

  • 100

    0.626715

  • 250

    0.617918

  • 500

    0.578189

  • 1000

    0.569364

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 1.378" (35.00mm)
Length 2.000" (50.80mm)
Series HSS
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.335" (8.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 16.66°C/W
Power Dissipation @ Temperature Rise 4.5W @ 75°C
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM