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HSS23-B20-NP

CUI Devices

型号:

HSS23-B20-NP

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-218/TO-2

购买数量:

库存 : 2588

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.741

  • 10

    0.71345

  • 25

    0.69312

  • 50

    0.65189

  • 100

    0.585865

  • 250

    0.5776

  • 500

    0.540493

  • 1000

    0.532238

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 1.496" (38.00mm)
Length 1.654" (42.00mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.787" (20.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 10.19°C/W
Power Dissipation @ Temperature Rise 7.36W @ 75°C
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 200 LFM