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HSS21-B20-P53

CUI Devices

型号:

HSS21-B20-P53

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-218/TO-2

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.961" (24.40mm)
Length 1.000" (25.40mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.500" (12.70mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 20.93°C/W
Power Dissipation @ Temperature Rise 3.58W @ 75°C
Thermal Resistance @ Forced Air Flow 10.10°C/W @ 200 LFM