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HSS14-B20-NP

CUI Devices

型号:

HSS14-B20-NP

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-220, 19.

购买数量:

库存 : 4992

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.7695

  • 10

    0.7334

  • 25

    0.69654

  • 50

    0.67811

  • 100

    0.668895

  • 250

    0.623086

  • 500

    0.586454

  • 1000

    0.531468

  • 5000

    0.513142

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.750" (19.05mm)
Length 0.980" (24.89mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.157" (4.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method -
Thermal Resistance @ Natural 23.91°C/W
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 11.60°C/W @ 200 LFM