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HSS02-B20-P318

CUI Devices

型号:

HSS02-B20-P318

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-220, 23.

购买数量:

库存 : 1518

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.1115

  • 10

    1.05545

  • 25

    1.0279

  • 50

    0.99997

  • 100

    0.944395

  • 250

    0.888896

  • 500

    0.833321

  • 1000

    0.777774

  • 5000

    0.749996

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.930" (23.62mm)
Length 1.900" (48.26mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.950" (24.13mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 10.90°C/W
Power Dissipation @ Temperature Rise 6.9W @ 75°C
Thermal Resistance @ Forced Air Flow 4.80°C/W @ 200 LFM