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HSS-C52-NP-SMT-TR

CUI Devices

型号:

HSS-C52-NP-SMT-TR

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK TO-252 COPPER

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 0.900" (22.86mm)
Length 0.315" (8.00mm)
Series HSS
Package Tape & Reel (TR)
Diameter -
Material Copper
Fin Height 0.400" (10.16mm)
Package Cooled TO-252 (DPak)
Product Status Active
Material Finish Tin
Attachment Method -
Base Product Number HSS-C52
Thermal Resistance @ Natural 35.71°C/W
Power Dissipation @ Temperature Rise 2.1W @ 75°C
Thermal Resistance @ Forced Air Flow 10.05°C/W @ 200 LFM