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HSS-C2540-SMT-TR

CUI Devices

型号:

HSS-C2540-SMT-TR

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK TO-263 COPPER

购买数量:

库存 : 150

最小起订量: 1 最小递增量: 1

数量

单价

  • 150

    1.582196

  • 300

    1.489154

  • 450

    1.396082

  • 1050

    1.303001

  • 7500

    1.25646

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 1.000" (25.40mm)
Length 0.763" (19.38mm)
Series HSS
Package Tape & Reel (TR)
Diameter -
Material Copper
Fin Height 0.450" (11.43mm)
Package Cooled TO-263 (D²Pak)
Product Status Active
Material Finish Tin
Attachment Method -
Base Product Number HSS-C2540
Thermal Resistance @ Natural 21.90°C/W
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow 5.50°C/W @ 200 LFM