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HSS-B20-085H

CUI Devices

型号:

HSS-B20-085H

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEATSINK TO-220 3.4W ALUMINUM

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.775" (19.68mm)
Length 0.303" (7.70mm)
Series HSS
Package Bag
Diameter -
Material Aluminum
Fin Height 0.790" (20.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Base Product Number HSS-B20
Thermal Resistance @ Natural 22.06°C/W
Power Dissipation @ Temperature Rise 3.4W @ 75°C
Thermal Resistance @ Forced Air Flow 7.46°C/W @ 200 LFM