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HSS-B20-0635H-01

CUI Devices

型号:

HSS-B20-0635H-01

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEATSINK TO-220 2.7W ALUMINUM

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 0.375" (9.53mm)
Length 0.520" (13.20mm)
Series HSS
Package Bag
Diameter -
Material Aluminum
Fin Height 0.748" (19.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Base Product Number HSS-B20
Thermal Resistance @ Natural 27.78°C/W
Power Dissipation @ Temperature Rise 2.7W @ 75°C
Thermal Resistance @ Forced Air Flow 9.51°C/W @ 200 LFM