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HSS-B20-061H-03

CUI Devices

型号:

HSS-B20-061H-03

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEATSINK TO-220 2.9W ALUMINUM

购买数量:

库存 : 2970

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.608

  • 10

    0.5757

  • 25

    0.54682

  • 50

    0.53257

  • 100

    0.52535

  • 250

    0.489364

  • 500

    0.46056

  • 1000

    0.417382

  • 5000

    0.40299

请发送询价,我们将立即回复。

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.512" (13.00mm)
Length 0.512" (13.00mm)
Series HSS
Package Bag
Diameter -
Material Aluminum
Fin Height 0.748" (19.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Base Product Number HSS-B20
Thermal Resistance @ Natural 25.86°C/W
Power Dissipation @ Temperature Rise 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow 5.72°C/W @ 200 LFM