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HSE11-B20-NP

CUI Devices

型号:

HSE11-B20-NP

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218/TO-

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Rectangular
Width 0.472" (12.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.177" (4.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 38.90°C/W
Power Dissipation @ Temperature Rise 1.93W @ 75°C
Thermal Resistance @ Forced Air Flow 21.40°C/W @ 200 LFM