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HSE07-753045

CUI Devices

型号:

HSE07-753045

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218/TO-

购买数量:

库存 : 971

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    3.23

  • 10

    3.12075

  • 25

    3.0305

  • 50

    2.85019

  • 100

    2.561485

  • 250

    2.525404

  • 500

    2.363049

  • 1000

    2.326978

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 1.181" (30.00mm)
Length 2.953" (75.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 1.772" (45.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Clip
Thermal Resistance @ Natural 4.85°C/W
Power Dissipation @ Temperature Rise 15.46W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM