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HSE06-503045

CUI Devices

型号:

HSE06-503045

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218/TO-

购买数量:

库存 : 1101

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.2325

  • 10

    2.15745

  • 25

    2.0957

  • 50

    1.97087

  • 100

    1.771275

  • 250

    1.74629

  • 500

    1.634038

  • 1000

    1.609082

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 1.181" (30.00mm)
Length 1.969" (50.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 1.772" (45.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Clip
Thermal Resistance @ Natural 5.86°C/W
Power Dissipation @ Temperature Rise 12.79W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM