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HSE04-251265-2

CUI Devices

型号:

HSE04-251265-2

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218/TO-

购买数量:

库存 : 2115

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.8265

  • 10

    0.79705

  • 25

    0.77368

  • 50

    0.7277

  • 100

    0.65398

  • 250

    0.644784

  • 500

    0.603326

  • 1000

    0.59412

请发送询价,我们将立即回复。

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 0.472" (12.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.256" (6.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 30.38°C/W
Power Dissipation @ Temperature Rise 2.47W @ 75°C
Thermal Resistance @ Forced Air Flow 16.60°C/W @ 200 LFM