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HSE-B254-04H

CUI Devices

型号:

HSE-B254-04H

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-220/TO-

购买数量:

库存 : 654

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.9595

  • 10

    0.912

  • 25

    0.88768

  • 50

    0.86355

  • 100

    0.815575

  • 250

    0.7676

  • 500

    0.719625

  • 1000

    0.67165

  • 5000

    0.647662

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 0.650" (16.50mm)
Length 1.000" (25.40mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.630" (16.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B254
Thermal Resistance @ Natural 15.96°C/W
Power Dissipation @ Temperature Rise 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow 4.93°C/W @ 200 LFM