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HSE-B18635-0396H

CUI Devices

型号:

HSE-B18635-0396H

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218, 63

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Angled Fins
Width 1.654" (42.00mm)
Length 2.500" (63.50mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B18635
Thermal Resistance @ Natural 5.47°C/W
Power Dissipation @ Temperature Rise 13.7W @ 75°C
Thermal Resistance @ Forced Air Flow 2.78°C/W @ 200 LFM