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HSE-B18317-035H-01

CUI Devices

型号:

HSE-B18317-035H-01

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-218, 31

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Angled Fins
Width 1.638" (41.60mm)
Length 1.250" (31.75mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method Clip and PC Pin
Base Product Number HSE-B18317
Thermal Resistance @ Natural 7.50°C/W
Power Dissipation @ Temperature Rise 10.0W @ 75°C
Thermal Resistance @ Forced Air Flow 4.33°C/W @ 200 LFM