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HSE-B1711-057

CUI Devices

型号:

HSE-B1711-057

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, EXTRUSION, TO-220, 25

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Rectangular, Fins
Width 0.625" (16.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.354" (9.00mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Base Product Number HSE-B1711
Thermal Resistance @ Natural 24.19°C/W
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 7.07°C/W @ 200 LFM