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HSB30-373710

CUI Devices

型号:

HSB30-373710

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 37.4 X 37 X 10 M

购买数量:

库存 : 545

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.128

  • 10

    2.05865

  • 25

    1.9988

  • 50

    1.87986

  • 100

    1.68948

  • 250

    1.665692

  • 500

    1.558608

  • 1000

    1.53482

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.472" (37.39mm)
Length 1.472" (37.39mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Push Pin
Thermal Resistance @ Natural 11.63°C/W
Power Dissipation @ Temperature Rise 6.45W @ 75°C
Thermal Resistance @ Forced Air Flow 4°C/W @ 200 LFM