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HSB26-343408

CUI Devices

型号:

HSB26-343408

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 33.5 X 33.5 X 8

购买数量:

库存 : 994

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.083

  • 10

    1.04595

  • 25

    1.01536

  • 50

    0.95513

  • 100

    0.858325

  • 250

    0.84626

  • 500

    0.791882

  • 1000

    0.779788

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.319" (33.50mm)
Length 1.319" (33.50mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.315" (8.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 15.19°C/W
Power Dissipation @ Temperature Rise 4.94W @ 75°C
Thermal Resistance @ Forced Air Flow 5.30°C/W @ 200 LFM