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HSB25-282810

CUI Devices

型号:

HSB25-282810

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 28.5 X 28.5 X 10

购买数量:

库存 : 1518

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.235

  • 10

    1.1951

  • 25

    1.16052

  • 50

    1.09155

  • 100

    0.98097

  • 250

    0.967176

  • 500

    0.905008

  • 1000

    0.891186

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.122" (28.50mm)
Length 1.122" (28.50mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Push Pin
Thermal Resistance @ Natural 15.41°C/W
Power Dissipation @ Temperature Rise 4.87W @ 75°C
Thermal Resistance @ Forced Air Flow 5.10°C/W @ 200 LFM