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HSB21-454515

CUI Devices

型号:

HSB21-454515

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 45 X 45 X 15 MM

购买数量:

库存 : 380

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.0235

  • 10

    1.9703

  • 25

    1.9171

  • 50

    1.81051

  • 100

    1.70411

  • 250

    1.597558

  • 500

    1.54432

  • 1000

    1.384558

  • 5000

    1.35793

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.772" (45.00mm)
Length 1.772" (45.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.591" (15.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 7.56°C/W
Power Dissipation @ Temperature Rise 9.9W @ 75°C
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM