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HSB20-353525

CUI Devices

型号:

HSB20-353525

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 35 X 35 X 25 MM

购买数量:

库存 : 478

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.881

  • 10

    1.8316

  • 25

    1.7822

  • 50

    1.6834

  • 100

    1.584315

  • 250

    1.485306

  • 500

    1.435792

  • 1000

    1.287269

  • 5000

    1.262512

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.378" (35.00mm)
Length 1.378" (35.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 6.65°C/W
Power Dissipation @ Temperature Rise 11.3W @ 75°C
Thermal Resistance @ Forced Air Flow 2.70°C/W @ 200 LFM