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HSB17-404025

CUI Devices

型号:

HSB17-404025

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 40 X 40 X 25 MM

购买数量:

库存 : 804

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.4035

  • 10

    2.3427

  • 25

    2.27962

  • 50

    2.15308

  • 100

    2.026445

  • 250

    1.89981

  • 500

    1.836483

  • 1000

    1.646502

  • 5000

    1.614838

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.575" (40.00mm)
Length 1.575" (40.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.984" (25.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 6.41°C/W
Power Dissipation @ Temperature Rise 11.7W @ 75°C
Thermal Resistance @ Forced Air Flow 2.10°C/W @ 200 LFM