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HSB15-404010

CUI Devices

型号:

HSB15-404010

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 40 X 40 X 10 MM

购买数量:

库存 : 1020

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.501

  • 10

    1.4288

  • 25

    1.39156

  • 50

    1.35413

  • 100

    1.278795

  • 250

    1.203612

  • 500

    1.128372

  • 1000

    1.053151

  • 5000

    1.015531

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.575" (40.00mm)
Length 1.575" (40.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 11.84°C/W
Power Dissipation @ Temperature Rise 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow 3.90°C/W @ 200 LFM