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HSB13-303014

CUI Devices

型号:

HSB13-303014

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 30.7 X 30.7 X 14

购买数量:

库存 : 419

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.2825

  • 10

    1.2217

  • 25

    1.1894

  • 50

    1.1571

  • 100

    1.09288

  • 250

    1.028584

  • 500

    0.964288

  • 1000

    0.900011

  • 5000

    0.867863

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.209" (30.70mm)
Length 1.209" (30.70mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.551" (14.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 12.36°C/W
Power Dissipation @ Temperature Rise 6.1W @ 75°C
Thermal Resistance @ Forced Air Flow 4.70°C/W @ 200 LFM