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HSB10-232306

CUI Devices

型号:

HSB10-232306

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 23 X 23 X 6 MM

购买数量:

库存 : 1309

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.798

  • 10

    0.7562

  • 25

    0.7182

  • 50

    0.69939

  • 100

    0.68989

  • 250

    0.642656

  • 500

    0.604865

  • 1000

    0.54816

  • 5000

    0.529264

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.906" (23.00mm)
Length 0.906" (23.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.236" (6.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 25.46°C/W
Power Dissipation @ Temperature Rise 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM