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HSB03-141406

CUI Devices

型号:

HSB03-141406

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 14 X 14 X 6 MM

购买数量:

库存 : 3465

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.703

  • 10

    0.67165

  • 25

    0.63802

  • 50

    0.6213

  • 100

    0.612845

  • 250

    0.570912

  • 500

    0.53732

  • 1000

    0.486951

  • 5000

    0.470155

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.551" (14.00mm)
Length 0.551" (14.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.236" (6.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 35.98°C/W
Power Dissipation @ Temperature Rise 2.1W @ 75°C
Thermal Resistance @ Forced Air Flow 15.80°C/W @ 200 LFM