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HSB03-121218

CUI Devices

型号:

HSB03-121218

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 12 X 12 X 18 MM

购买数量:

库存 : 2268

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.8645

  • 10

    0.81985

  • 25

    0.77862

  • 40

    0.757862

  • 80

    0.747774

  • 230

    0.696512

  • 440

    0.655519

  • 2520

    0.594073

  • 5040

    0.573591

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.472" (12.00mm)
Length 0.472" (12.00mm)
Series HSB
Package Tray
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 24.01°C/W
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 200 LFM