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HSB02-101007

CUI Devices

型号:

HSB02-101007

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 10 X 10 X 7 MM

购买数量:

库存 : 3172

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.6365

  • 10

    0.6061

  • 25

    0.57608

  • 50

    0.56088

  • 100

    0.553375

  • 250

    0.515432

  • 500

    0.485127

  • 1000

    0.439641

  • 5000

    0.424479

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.394" (10.00mm)
Length 0.394" (10.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.275" (7.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 37.90°C/W
Power Dissipation @ Temperature Rise 2.0W @ 75°C
Thermal Resistance @ Forced Air Flow 16.50°C/W @ 200 LFM