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HSB01-080808

CUI Devices

型号:

HSB01-080808

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

购买数量:

库存 : 1190

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.6935

  • 10

    0.66405

  • 25

    0.6308

  • 50

    0.61427

  • 100

    0.60591

  • 250

    0.564376

  • 500

    0.531183

  • 1000

    0.481384

  • 5000

    0.464778

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.335" (8.50mm)
Length 0.335" (8.50mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.315" (8.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive (Not Included)
Thermal Resistance @ Natural 39.10°C/W
Power Dissipation @ Temperature Rise 1.9W @ 75°C
Thermal Resistance @ Forced Air Flow 16.00°C/W @ 200 LFM