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HPC 252012BMV-3R3M

TAI-TECH Advanced Electronics Co., Ltd.

型号:

HPC 252012BMV-3R3M

封装:

1008

批次:

-

数据手册:

描述:

3.3 UH SHIELDED DRUM CORE, WIREW

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr TAI-TECH Advanced Electronics Co., Ltd.
Type Wirewound
Series -
Package Tape & Reel (TR)
Ratings AEC-Q200
Features -
Q @ Freq -
Shielding Shielded
Tolerance ±20%
Inductance 3.3 µH
Mounting Type Surface Mount
Package / Case 1008 (2520 Metric)
Product Status Active
Material - Core -
Size / Dimension 0.098" L x 0.079" W (2.50mm x 2.00mm)
DC Resistance (DCR) 32mOhm Max
Current Rating (Amps) 1.9 A
Height - Seated (Max) 0.047" (1.20mm)
Operating Temperature -55°C ~ 125°C
Supplier Device Package 1008
Frequency - Self Resonant -
Current - Saturation (Isat) 1.5A
Inductance Frequency - Test 100 kHz