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BDN11-3CB/A01

CTS Thermal Management Products

型号:

BDN11-3CB/A01

封装:

-

批次:

-

数据手册:

描述:

HEATSINK CPU W/ADHESIVE 1.11"SQ

购买数量:

库存 : 1274

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.223

  • 10

    2.1622

  • 25

    2.1033

  • 50

    1.98664

  • 100

    1.86979

  • 250

    1.752902

  • 500

    1.694458

  • 1000

    1.519174

  • 5000

    1.489961

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产品信息

参数信息
用户指南
Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Pin Fins
Width 1.110" (28.19mm)
Length 1.110" (28.19mm)
Series BDN
Package Box
Diameter -
Material Aluminum
Fin Height 0.355" (9.02mm)
Shelf Life 24 Months
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Included)
Base Product Number BDN11
Thermal Resistance @ Natural 20.90°C/W
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 7.20°C/W @ 400 LFM