CTS Thermal Management Products
型号:
BDN09-3CB
封装:
-
批次:
-
数据手册:
-
描述:
HEATSINK CPU .91" SQ
购买数量:
最小起订量: 1 最小递增量: 1
数量
单价
1
1.311
10
1.2483
25
1.21562
50
1.18275
100
1.11701
250
1.051308
500
0.985606
1000
0.919904
5000
0.887053
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Mfr | CTS Thermal Management Products |
Type | Top Mount |
Shape | Square, Pin Fins |
Width | 0.910" (23.11mm) |
Length | 0.910" (23.11mm) |
Series | BDN |
Package | Box |
Diameter | - |
Material | Aluminum |
Fin Height | 0.355" (9.02mm) |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Base Product Number | BDN09 |
Thermal Resistance @ Natural | 26.90°C/W |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |