BDN09-3CB

CTS Thermal Management Products

型号:

BDN09-3CB

封装:

-

批次:

-

数据手册:

-

描述:

HEATSINK CPU .91" SQ

购买数量:

库存 : 990

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.311

  • 10

    1.2483

  • 25

    1.21562

  • 50

    1.18275

  • 100

    1.11701

  • 250

    1.051308

  • 500

    0.985606

  • 1000

    0.919904

  • 5000

    0.887053

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产品信息

参数信息
用户指南
Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Pin Fins
Width 0.910" (23.11mm)
Length 0.910" (23.11mm)
Series BDN
Package Box
Diameter -
Material Aluminum
Fin Height 0.355" (9.02mm)
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Base Product Number BDN09
Thermal Resistance @ Natural 26.90°C/W
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM