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HSS23-B20-NP

CUI Devices

Product No:

HSS23-B20-NP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218/TO-2

Quantity:

In Stock : 2588

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    0.741

  • 10

    0.71345

  • 25

    0.69312

  • 50

    0.65189

  • 100

    0.585865

  • 250

    0.5776

  • 500

    0.540493

  • 1000

    0.532238

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Top Mount
Shape Rectangular, Fins
Width 1.496" (38.00mm)
Length 1.654" (42.00mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.787" (20.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On
Thermal Resistance @ Natural 10.19°C/W
Power Dissipation @ Temperature Rise 7.36W @ 75°C
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 200 LFM