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HSS08-B18-CP

CUI Devices

Product No:

HSS08-B18-CP

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, STAMPING, TO-218, 44.

Quantity:

In Stock : 988

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    1.9475

  • 10

    1.89905

  • 25

    1.84794

  • 50

    1.74534

  • 100

    1.642645

  • 250

    1.539988

  • 500

    1.488669

  • 1000

    1.334664

  • 5000

    1.308996

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level, Vertical
Shape Square
Width 1.750" (44.45mm)
Length 1.750" (44.45mm)
Series HSS
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.492" (12.50mm)
Package Cooled TO-218
Product Status Active
Material Finish Black Anodized
Attachment Method PC Pin
Thermal Resistance @ Natural 7.29°C/W
Power Dissipation @ Temperature Rise 10.3W @ 75°C
Thermal Resistance @ Forced Air Flow 3.50°C/W @ 200 LFM