HSB18-232310
CUI Devices
Product No:
HSB18-232310
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 10 MM
Quantity:
In Stock : 5332
Minimum: 1 Multiples: 1
Qty
Unit Price
1
0.988
10
0.9386
25
0.89148
50
0.86792
100
0.856235
250
0.79762
500
0.750709
1000
0.680333
5000
0.656878
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 20.41°C/W |
| Power Dissipation @ Temperature Rise | 3.7W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 6.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
